We propose a method to improve the thermal stability of thin CoSi2 layers o
n polycrystalline silicon substrates. Nitrogen atoms have been implanted at
55 keV to a dose of 5x10(15)/cm(2) through a 70 nm silicide layer in order
to locate the implanted peak near the silicide/silicon interface. The larg
e band of cavities created at the interface has extended the thermal stabil
ity window by 125 degreesC with respect to the standard process. The improv
ement has been related to the silicide grain-boundary pinning due to the in
crease of the interface free energy contribution. (C) 2001 American Institu
te of Physics.