Mode-III interface edge crack between two bonded quarter-planes of dissimilar piezoelectric materials

Authors
Citation
Xf. Li et Ty. Fan, Mode-III interface edge crack between two bonded quarter-planes of dissimilar piezoelectric materials, ARCH APPL M, 71(10), 2001, pp. 703-714
Citations number
20
Categorie Soggetti
Mechanical Engineering
Journal title
ARCHIVE OF APPLIED MECHANICS
ISSN journal
09391533 → ACNP
Volume
71
Issue
10
Year of publication
2001
Pages
703 - 714
Database
ISI
SICI code
0939-1533(200110)71:10<703:MIECBT>2.0.ZU;2-C
Abstract
The problem of an interface edge crack between two bonded quarter-planes of dissimilar piezoelectric materials is considered under the conditions of a nti-plane shear and inplane electric loading. The crack surfaces are assume d to be impermeable to the electric field. An integral transform technique is employed to reduce the problem under consideration to dual integral equa tions. By solving the resulting dual integral equations, the intensity fact ors of the stress and the electric displacement and the energy release rate as well as the crack sliding displacement and the electric voltage across the crack surfaces are obtained in explicit form for the case of concentrat ed forces and free charges at the crack surfaces and at the boundary. The d erived results can be taken as fundamental solutions which can be superpose d to model more realistic problems.