The impact of the furnace nitridation time in N2O ambient on the quali
ty of the Si/SiO2 system is analyzed in detail. It is shown that, for
a high temperature furnace nitridation process step, a long duration o
f nitridation may give rise to degradation phenomena for MOS structure
s grown on n-type Si, whereas this is not the case for MOS devices for
med on p-type Si substrate. A qualitative model which explains this an
omalous behaviour is also proposed.