Crystallization behavior of amorphous Cr-Si-Ni thin films was investigated
by means of high temperature in situ X-ray diffraction measurements. The di
ffraction spectra were recorded isothermally at temperature between 250 and
750 degreesC. The in situ testing of crystallization enables the direct ob
servation of structure evolution which is dependent on heat treatment. Base
d on the testing results, the grain sizes of the crystalline phases were co
mpared and phase transition tendency was understood. In the mean time, elec
trical properties of the films as functions of annealing temperature and ti
me have been studied. The increase of volume fraction of CrSi2 crystalline
phases in the Cr-Si-Ni films leads to the decrease in conductivity of the f
ilms. The annealing behavior of temperature coefficient of resistance (TCR)
is a result of competition between a negative contribution caused by the w
eak localization effects in amorphous region and a positive contribution ca
used by CrSi2 grains. Thus the proper mixture of amorphous and crystalline
constituents could result in a final zero TCR.