Cas. Lima et al., Influence of the thermal annealing on the electrical resistivity and thermal diffusivity of Pd : Ag nanocomposites, MATER LETT, 51(4), 2001, pp. 357-362
In this paper, we report on the influence of thermal annealing on the elect
rical and thermal properties of nano-clustered Pd:Ag particles packed into
compressed thin wafers. The nano-crystalline Pd:Ag compacts were prepared b
y solvent evaporation of non-aqueous metal colloids prepared by clustering
of metal atoms in organic solvents at low temperature. Samples of Pd:Ag nan
o-clustered powder so obtained were then compressed into roughly 250 mum th
ick, 10 mm diameter wafers, and annealed at different temperatures, for abo
ut 1 h. The dependence of the electrical resistivity and of the thermal dif
fusivity of the resulting compacts on their corresponding annealing tempera
tures were investigated using a LCR impedance meter and a photoacoustic the
rmal diffusivity measurement apparatus. (C) 2001 Elsevier Science B.V. All
rights reserved.