Influence of the thermal annealing on the electrical resistivity and thermal diffusivity of Pd : Ag nanocomposites

Citation
Cas. Lima et al., Influence of the thermal annealing on the electrical resistivity and thermal diffusivity of Pd : Ag nanocomposites, MATER LETT, 51(4), 2001, pp. 357-362
Citations number
21
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
MATERIALS LETTERS
ISSN journal
0167577X → ACNP
Volume
51
Issue
4
Year of publication
2001
Pages
357 - 362
Database
ISI
SICI code
0167-577X(200111)51:4<357:IOTTAO>2.0.ZU;2-O
Abstract
In this paper, we report on the influence of thermal annealing on the elect rical and thermal properties of nano-clustered Pd:Ag particles packed into compressed thin wafers. The nano-crystalline Pd:Ag compacts were prepared b y solvent evaporation of non-aqueous metal colloids prepared by clustering of metal atoms in organic solvents at low temperature. Samples of Pd:Ag nan o-clustered powder so obtained were then compressed into roughly 250 mum th ick, 10 mm diameter wafers, and annealed at different temperatures, for abo ut 1 h. The dependence of the electrical resistivity and of the thermal dif fusivity of the resulting compacts on their corresponding annealing tempera tures were investigated using a LCR impedance meter and a photoacoustic the rmal diffusivity measurement apparatus. (C) 2001 Elsevier Science B.V. All rights reserved.