The ionization dynamics of the complexes composed of CF4 and H2O, which pla
ys an important role in plasma dry-etching processes on semi-conductor surf
ace, have been investigated by means of full dimensional direct ab initio t
rajectory calculations in order to shed light on mechanism of plasma dry et
ching of silicon surface by CF4. Effect of a water molecule existing near C
F4 on the ionization dynamics of CF4 was examined. The trajectory calculati
ons showed that the water molecule affects strongly the reaction mechanism:
namely, H2O molecule reacts with CF4+ to form [CF3OH2](+) complex after th
e ionization of CF4. The reaction is expressed by
[CF4-H2O] --> (hv)(-e) [CF4-H2O](ver)(+) --> [CF3OH2](+) + F
where [CF4-H2O](ver)(+) means a vertical ionized point of the complex. The
fraction of the kinetic energy of F atom is 40% of the total available ener
gy, which is significantly smaller than that of the dissociation of free CF
4 (65%). The reaction energy is dissipated mostly as the internal energy of
the [CF3OH2](+) complex. Also, we found the other reaction channel express
ed by
[CF4-H2O] (-e)--> (hv) [CF4-H2O](ver)(+) --> CF3+ + F + H2O
This channel is three-body dissociation channel. The reaction mechanism was
discussed on the basis of the present calculations. (C) 2001 Elsevier Scie
nce B.V. All rights reserved.