Materials processing using an atmospheric pressure, RF-generated plasma source

Processing materials at atmospheric pressure provides clear advantages over traditional, vacuum-based plasma processing: in addition to reduction in t he capital cost of equipment and the elimination of constraints imposed by vacuum-compatibility, high pressure and low temperature plasma processes of fer unprecedented improvements for generation of active chemical species, h igh chemical selectivity, minimal ion densities resulting in low Surface da mage and surface treatment methods unattainable by other means. We describe several variations of this unique plasma source and some of its potential applications.