Metallic conductive LaNiO3 thin films have been prepared by the chemical so
lution deposition method. A homogeneous and stable LaNiO3 precursor solutio
n was prepared by controlling the reaction of metal organics. Dehydration o
f the starting material Ni(acac)(2) (.) 2H(2)O was a key factor in preparin
g a proper LaNiO3 precursor solution, because the hydrolysis of La(OPr)(3)
has to be suppressed through the removal of hydrated water. The precursor f
ilms were prepared from the solution by dip-coating and spin-coating. 110-o
riented LaNiO3 thin films were synthesized from the LaNiO3 precursor soluti
on on fused silica substrates at 700 degreesC. LaNiO3 film prepared by spin
-coating had a better surface smoothness than that prepared by dip-coating.
The resistivities of 100-nm-thick LaNiO3 films prepared by dip-coating and
spin-coating were 3.8 x 10(-5) Omega m and 2.9 x 10(-5) Omega in, respecti
vely, at room temperature.