Ma. Djouadi et al., Growth of cubic boron nitride films by ibad and triode sputtering: development of intrinsic stress, DIAM RELAT, 10(12), 2001, pp. 2167-2173
Two methods are employed to evidenced the stress behavior in c-BN films. On
the one hand, in depth stress profile of c-BN film, deposited by ion beam
assisted evaporation, was performed by recording infrared spectra and subst
rate curvature after reactive ion etching (RIE) steps. It shows a peak of s
tress up to - 17 GPa in the h-BN basal layer and a stress relaxation when t
he cubic phase appears. On the other hand, dynamic stress profiles of c-BN
films deposited by a triode sputtering system, are obtained by recording in
frared spectra and substrate curvature after various c-BN deposition times,
with the same experimental conditions. Likewise, a peak of stress of - 12
GPa is unmistakably observed in the h-BN basal layer followed by a stress r
elease during c-BN nucleation, where an average value of - 12 GPa is observ
ed in the c-BN film volume. These results provide a support for the stress
model proposed by McKenzie even if along with a minimum stress a high level
of densification of the layer is needed. (C) 2001 Elsevier Science B.V. Al
l rights reserved.