Interfacial development and microstructural imperfection of multilayer ceramic chips with Ag/Pd electrodes

The interfacial microstructure between Ag/Pd electrodes and PMN-PZN-PT rela xor ferroelectric ceramics in cofired multilayer ceramic devices was invest igated by transmission electron microscopy and scanning electron microscopy . Disadvantageous interfacial defects, such as delaminations, warping, gas holes and exaggerated grain growth, were identified. In addition to the pre paration process, the composition of the inner electrode paste and the sint ering densification compatibility between the layers played important roles in the interfacial development. The relationship of the interfacial micros tructure to the reliability of the device is discussed. (C) 2001 Elsevier S cience Ltd and Techna S.r.l. All rights reserved.