Interconnect layout optimization under higher order RLC model for MCM designs

Citation
J. Cong et al., Interconnect layout optimization under higher order RLC model for MCM designs, IEEE COMP A, 20(12), 2001, pp. 1455-1463
Citations number
34
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS
ISSN journal
02780070 → ACNP
Volume
20
Issue
12
Year of publication
2001
Pages
1455 - 1463
Database
ISI
SICI code
0278-0070(200112)20:12<1455:ILOUHO>2.0.ZU;2-2
Abstract
In this paper, we study the interconnect layout optimization problem under a higher order resistance-inductance-capacitance model to optimize not only delay, but also waveform. for interconnects with nonmonotone signal respon se in the context of multipchip-module global routing. We propose a unified approach that considers topology optimization and waveform optimization si multaneously. Using a new incremental moment-computation algorithm, we inte rleave topology construction with moment computation to facilitate accurate delay calculation and evaluation of waveform quality. Our algorithm consid ers a large class of routing topologies, ranging from shortest path Steiner trees to bounded-radius Steiner trees and Steiner routings. We construct a set of required arrival-time Steiner (RATS) trees, providing smooth tradeo ffs among signal delay, waveform, and routing area. When combined with the MINOTAUR MCM global router (Cong and Madden, 1998), (Madden, 1998) that we have developed, the RATS-tree solutions prove to be effective in reducing o verall routing congestion.