A comparison of the hot-compaction behavior of oriented, high-modulus, polyethylene fibers and tapes

Citation
Pj. Hine et al., A comparison of the hot-compaction behavior of oriented, high-modulus, polyethylene fibers and tapes, J MACR S PH, B40(5), 2001, pp. 959-989
Citations number
24
Categorie Soggetti
Organic Chemistry/Polymer Science
Journal title
JOURNAL OF MACROMOLECULAR SCIENCE-PHYSICS
ISSN journal
00222348 → ACNP
Volume
B40
Issue
5
Year of publication
2001
Pages
959 - 989
Database
ISI
SICI code
0022-2348(2001)B40:5<959:ACOTHB>2.0.ZU;2-4
Abstract
The purpose of this article is twofold. First, there is an account of the h ot-compaction behavior of a new, Highly oriented, high-modulus polyethylene (PE) tape with the trade name of Tensylon(R) (manufactured by Synthetic In dustries, USA). This tape, produced by a melt spinning route, has mechanica l properties comparable to those of commercially available gel-spun fibers. Unidirectional samples were produced for a range of compaction temperature s to determine the optimum compaction conditions to obtain the best mechani cal properties of the resulting compacted sheets. Second, the mechanical pr operties of the best Tensylon sample, manufactured at a compaction temperat ure of 153 degreesC, was compared with three other hot-compacted, highly or iented PE materials, based on Certran(R), Dyneema(R), and Spectra(R) commer cial PE fibers. The results showed that the optimum compaction temperature was in most cases about 1 degreesC below the point at which substantial cry stalline melting occurred. At this optimum temperature, differential scanni ng calorimetry (DSC) melting studies showed that approximately 30% of the o riginal oriented phase had been lost to bond the structure together. In the case of Dyneema, the properties of the fiber were not translated into the properties of a compacted sheet, and morphological studies showed that this was because melting did not occur on the fiber surfaces, but rather in the interior of the fiber due to a skin structure. The properties of the compa cted Tensylon tapes were found to be exceptional, combining very high modul us and strength with interlayer bonding and good creep resistance. Moreover , the optimum temperature appeared to be about 2 degreesC below the point a t which complete melting occurred, giving a wider processing window for thi s material.