The use of polycarbonates as thermally decomposable, sacrificial materials
for the formation of microchannels is presented. Pol, carbonates decompose
in the temperature range of 200-300 degreesC. Two polycarbonates, polyethyl
ene carbonate and polypropylene carbonate, have been used to fabricate micr
ochannels in three different types of encapsulants: an inorganic glass (sil
icon dioxide), a thermoplastic polymer (Avatrel dielectric polymer) and a t
hermoset polymer (bisbenzoycyclobutene Cyclotene 3022-57). This paper prese
nts the details of the fabrication process, a thermogravimetric analysis of
the sacrificial materials, and the kinetic parameters for the decompositio
n process. The presence of oxygen or water was found to impact on the decom
position of the sacrificial material. This paper demonstrates the feasibili
ty of forming buried air-cavities in a variety of encapsulants at a modest
temperature, thus enabling the use of a wide range of dielectric materials
with different thermal stabilities and properties.