Modeling thermally activated deformation with a variety of obstacles, and its application to creep transients

Authors
Citation
Gs. Daehn, Modeling thermally activated deformation with a variety of obstacles, and its application to creep transients, ACT MATER, 49(11), 2001, pp. 2017-2026
Citations number
25
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
ACTA MATERIALIA
ISSN journal
13596454 → ACNP
Volume
49
Issue
11
Year of publication
2001
Pages
2017 - 2026
Database
ISI
SICI code
1359-6454(20010622)49:11<2017:MTADWA>2.0.ZU;2-L
Abstract
A material is modeled as an array of a variety of coupled elements of varie d strength, each of which is characterized by a slip probability that is a function of local stress and temperature. A stochastic cellular automaton i s used to run simulations of nominally constant structure creep where simpl e rules are used to ensure rough compliance with mechanical equilibrium and compatibility. Three cases are studied that incorporate distinctly differe nt statistical and spatial strength distributions. For all three simulation conditions, a general form of creep curve is obtained. The general form, w hen plotted as log(strain) vs. log(time), has a slope near unity at short a nd long times which are connected by a region of minimum slope. The slope o f the central region increases systematically with increasing temperature. These features are consistent with several experimental observations. The s ame simulation can also provide reasonable predictions of anelastic backflo w. This analysis can be of value in interpreting experimental observations in both forward and reverse creep transients. (C) 2001 Acta Materialia Inc. Published by Elsevier Science Ltd. All rights reserved.