Fabrication process of field emitter arrays using focused ion and electronbeam induced reaction

Citation
C. Ochiai et al., Fabrication process of field emitter arrays using focused ion and electronbeam induced reaction, J VAC SCI B, 19(3), 2001, pp. 933-935
Citations number
13
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B
ISSN journal
10711023 → ACNP
Volume
19
Issue
3
Year of publication
2001
Pages
933 - 935
Database
ISI
SICI code
1071-1023(200105/06)19:3<933:FPOFEA>2.0.ZU;2-L
Abstract
Metal-gated Pt field emitter arrays (FEAs) have been manufactured using a d ual beam system consisting of focused ion and electron beams. The gate open ing in Nb or Au gate layers was produced by physical sputtering using a foc used ion beam and subsequent wet etching of the underlying silicon dioxide layer. Deposition of a platinum tip into the gate opening using electron-be am-induced chemical reaction resulted in field emission without any thermal annealing process. After wet etching an enlargement of the gate opening in Nb-gated FEAs was observed due to the beam-induced enhanced etching. In co ntrast, the smaller gate opening in Au-gated FEAs was easily fabricated bec ause of the suppression of the enhanced etching. Consequently, the gate ope ning was controlled by selection of the gate metal material. The turn-on vo ltage for field emission decreased by decreasing the diameter of the gate o pening. (C) 2001 American Vacuum Society.