Recent development of diamond field emitter cathodes and devices fabricated
from molding process is presented. Practical modifications involving the s
p(2) content, surface treatment, boron doping, and tip sharpening to furthe
r enhance diamond field emission are discussed. A new fabrication process f
or achieving ultrasharp diamond tips with a radius of curvature less than 5
nm has been achieved and shows significant improvement in emission charact
eristics. Discussion of this enhanced emission in diamond microtips is pres
ented in accordance with analysis of emission behavior. The development of
high site density of uniform diamond microtip arrays is presented. We also
report the development of a new technique to fabricate self-aligned gate di
amond emitter diodes, which achieve very high emission characteristics at e
xtremely low applied voltage. The latest development aims to integrate diam
ond field emitters with silicon-based MEMS processing technology and achiev
e totally monolithic diamond field emitter devices on silicon wafers. Preli
minary results in the triode-configuration demonstrate promising transistor
characteristics suitable for vacuum microelectronic applications. (C) 2001
American Vacuum Society.