Combined effects of humidity and thermal stress on the dielectric properties of epoxy-silica composites

Authors
Gonon, P Sylvestre, A Teysseyre, J Prior, C
Citation
P. Gonon et al., Combined effects of humidity and thermal stress on the dielectric properties of epoxy-silica composites, MAT SCI E B, 83(1-3), 2001, pp. 158-164
Citations number
24
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY
ISSN journal
09215107 → ACNP
Volume
83
Issue
1-3
Year of publication
2001
Pages
158 - 164
Database
ISI
SICI code
0921-5107(20010621)83:1-3<158:CEOHAT>2.0.ZU;2-0
Abstract
We report on the effects of hydrothermal ageing on the dielectric propertie s of epoxy-silica composites used for microelectronic packaging. The study was carried out for samples with various degrees of curing. Epoxy compounds were subjected to moisture exposure (standard JEDEC procedures) and consec utive thermal stress (240 degreesC), Changes in the dielectric constant and in the loss factor were measured in the 100 Hz-100 kHz frequency range. It is found that water absorption increases with curing. After ageing the die lectric constant is decreased and the loss factor increased. Cured material s have a higher resistance against hydrothermal ageing. (C) 2001 Elsevier S cience B.V, All rights reserved.