A power integrated circuit process has been developed, based on silicon-on-
insulator, which allows intelligent CMOS control circuitry to be placed alo
ngside integrated high-voltage power devices. A breakdown voltage of 335 V
has been obtained by using a silicon layer of 4 mum thickness together with
a buried oxide layer of 3 mum thickness. The respective LDMOS specific on-
resistance and LIGBT on-state voltage for this breakdown voltage were 148 m
Omega cm(2) and 3.9 V, respectively. (C) 2001 Published by Elsevier Scienc
e Ltd. All rights reserved.