Two-dimensional, electrostatic finite element study of tip-substrate interactions in electric force microscopy of high density inter-connect structures

Two-dimensional electrostatic finite element modeling is used to estimate t he variation of tip force as a function of potential, dielectric film thick ness, and tip-substrate spacing when imaging using electric force microscop y. Blanket dielectric films and similar to 1000 nm thick interconnect struc tures were studied. We conclude that sidewall damage regions can be detecte d but will require special processing to make an unambiguous measurement. ( C) 2001 Elsevier Science B.V. All rights reserved.