This work investigates the floating body effect (FBE) on the partially depl
eted SOI devices at various temperatures for high-performance 0.1 mum MOSFE
T. The thermal effect on the device's characteristics was investigated with
respect to the body contacted MOSFET (BC-SOI) and floating body MOSFET wit
hout body contacted (FB-SOI). It is found that the threshold voltage (Vth)
and the off state drain current (I-OFF) Of the BC-SOI devices are more temp
erature sensitive than those of the FB-SOI devices. Far operation at higher
temperatures, there is no apparent difference in driving capability betwee
n the BC-SOI and FB-SOI MOSFETs.