It is well known that for the design and simulation of state-of-the-art cir
cuits thermal effects like self-heating and coupling between individual dev
ices must be taken into account. As compact models for modern or experiment
al devices are not readily available, a mixed-mode device simulator capable
of thermal simulation is a valuable source of information. Considering sel
f-heating and coupling effects results in a very complex equation system wh
ich can only be solved using sophisticated techniques. We present a fully c
oupled electrothermal mixed-mode simulation of an SiGe HBT circuit using th
e design of the mu A709 operational amplifier By investigating the influenc
e of self-heating effects on the device behavior we demonstrate that the co
nsideration of a simple power dissipation model instead of the lattice heat
flow equation is a very good approximation of the more computation time co
nsuming solution of the lattice heat flow equation.