Fast and accurate quasi-three-dimensional capacitance determination of multilayer VLSI interconnects

A new fast and accurate capacitance determination methodology for intricate multilayer VLSI interconnects is presented, Since a multilayer interconnec t structure is too complicated to be directly tractable, it is simplified b y investigating charge distributions within the system, The quasi-three-dim ensional (3-D) capacitances of the structure are then determined by combini ng a set of solid-ground-based two-dimensional (2-D) capacitances and shiel ding effects that can be independently calculated from the simplified struc ture, The shielding effects due to the neighboring lines of a line can be a nalytically determined from the given layout dimensions, The solid-ground-b ased 2-D capacitances can also be quickly computed from the simplified stru cture. Thus, the proposed capacitance determination methodology is much mor e cost-efficient than conventional 3-D-based methods. It is shown that the calculated quasi-3-D capacitances have excellent agreement with 3-D held-so lver-based results within 5% error.