Electro-epitaxial lateral overgrowth of silicon from liquid-metal solutions

Citation
Mg. Mauk et Jp. Curran, Electro-epitaxial lateral overgrowth of silicon from liquid-metal solutions, J CRYST GR, 225(2-4), 2001, pp. 348-353
Citations number
19
Categorie Soggetti
Physical Chemistry/Chemical Physics
Journal title
JOURNAL OF CRYSTAL GROWTH
ISSN journal
00220248 → ACNP
Volume
225
Issue
2-4
Year of publication
2001
Pages
348 - 353
Database
ISI
SICI code
0022-0248(200105)225:2-4<348:ELOOSF>2.0.ZU;2-O
Abstract
Monocrystalline silicon films are formed on patterned, metal-masked silicon substrates by a liquid-phase electro-epitaxial lateral overgrowth process. More specifically, silicon films are grown from liquid-metal solutions: (m olten bismuth saturated with silicon) by current-induced crystallization on stripe-patterned, tungsten-masked (1 1 1) silicon substrates. Growth tempe ratures range from 800 degreesC to 1150 degreesC, and a current density of 2-20 A/cm(2) is imposed across the silicon/melt interface to effect growth. Continuous (over 1 cm(2) areas) epitaxial layers of silicon are achieved o n tungsten-masked substrates patterned with 10-mum wide stripe openings spa ced 100 mum apart. New types of solar cells and photodiodes, wherein the me tal mask functions as a reflective "buried mirror" layer to increase optica l coupling and internal quantum efficiency, are realized with this silicon liquid-phase electro-epitaxy process. (C) 2001 Elsevier Science B.V. All ri ghts reserved.