Multimodule tape head assembly and measurement

Citation
Av. Lakshmikumaran et al., Multimodule tape head assembly and measurement, J INF S P S, 3(1-2), 2001, pp. 101-108
Citations number
7
Categorie Soggetti
Information Tecnology & Communication Systems
Journal title
JOURNAL OF INFORMATION STORAGE AND PROCESSING SYSTEMS
ISSN journal
10998047 → ACNP
Volume
3
Issue
1-2
Year of publication
2001
Pages
101 - 108
Database
ISI
SICI code
1099-8047(200101/04)3:1-2<101:MTHAAM>2.0.ZU;2-Z
Abstract
The appropriate tape wrap on individual cylindrical modules achieves the he ad-tape spacing requirements of a multimodule tape head contour. High linea r recording densities in high-performance tape drives require contour desig ns that reduce tape wrap tolerance. High track densities lead to reduced el ement-to-element spacing in the direction of tape motion further reducing t he tolerance on desired tape wrap. The achievable tape wrap is a function o f the cylindrical profile, which is characterized by the radius and centerl ine location. Subsequently, tolerances and measurement of the cylindrical p rofile and the precision of the multimodule assembly process become critica l. A geometrical analysis of the relationship between the tolerance in the multimodule assembly and that of the cylindrical profile is presented. Such analysis is used to compare different techniques for multimodule assembly. Laser triangulation and multipoint interferometer systems are presented to simply, accurately, cheaply, and quickly measure cylindrical profiles.