C. Kawai et al., Fabrication of Al-Si3N4 composites using a high-strength porous Si3N4 ceramic and their thermal conductivity, J CERAM S J, 109(6), 2001, pp. 565-569
Al-Si3N4 composites were fabricated by infiltration of Al melt with Si cont
ents from 0 to 22 vol% into a porous Si3N4 ceramic and their thermal conduc
tivity was evaluated. A porous Si3N4 ceramic having a porosity of 39.5% and
consisting of elongated beta -Si3N4 grains connected at random in three di
mensions was used as a substrate. The Al-Si3N4 composites were fabricated b
y infiltration of Al-Si alloys melt into the porous Si3N4 ceramic at 800 de
greesC under a pressure of 90 MPa using hot isostatic pressing (HIP). Altho
ugh increasing Si content significantly decreased the thermal conductivity
of the Al-Si alloys, the decrease in thermal conductivity of the resulting
composites was small due to increased thermal barrier conductances of the i
nterfaces between Al and Si3N4.