Reliability evaluation of a silicon-on-silicon MCM-D package

This paper presents the results of reliability testing on a multichip modul e technology with active silicon substrates. The modules use nip-chip techn ology to attach silicon chips to the active substrate and this assembly is then packaged into a plastic ball grid array package. Performance was evalu ated using two custom designed test chips incorporating thermal, thermomech anical, electrical and reliability test structures. A rigorous environmenta l test sequence including temperature, cycling, humidity, highly accelerate d stress test and power cycling were carried out on the demonstrators. A fu ll destructive physical analysis was then performed, consisting of die/subs trate shear, wire bond pull tests and microsectioning. (C) 2001 Elsevier Sc ience Ltd. All rights reserved.