Study of indium bumps for the ATLAS pixel detector

Authors
Gemme, C Fiorello, AM Gagliardi, G Gilchriese, M Netchaeva, P Rossi, L Ruscino, E Vernocchi, F Varasi, M
Citation
C. Gemme et al., Study of indium bumps for the ATLAS pixel detector, NUCL INST A, 465(1), 2001, pp. 200-203
Citations number
1
Categorie Soggetti
Spectroscopy /Instrumentation/Analytical Sciences","Instrumentation & Measurement
Journal title
NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION A-ACCELERATORS SPECTROMETERS DETECTORS AND ASSOCIATED EQUIPMENT
ISSN journal
01689002 → ACNP
Volume
465
Issue
1
Year of publication
2001
Pages
200 - 203
Database
ISI
SICI code
0168-9002(20010601)465:1<200:SOIBFT>2.0.ZU;2-O
Abstract
The bump-bonding technology is used to join the front-end read-out chips to the silicon substrate of the ATLAS pixel detector. We review the current s tatus of the technology used by Alenia Marconi Systems and we report on the electrical and mechanical properties and the defect rate of the Indium bum ps. (C) 2001 Elsevier Science B.V. All rights reserved.