Ion implantation and thermal annealing in silicon carbide and gallium nitride

Citation
W. Jiang et al., Ion implantation and thermal annealing in silicon carbide and gallium nitride, NUCL INST B, 178, 2001, pp. 204-208
Citations number
26
Categorie Soggetti
Spectroscopy /Instrumentation/Analytical Sciences","Instrumentation & Measurement
Journal title
NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS
ISSN journal
0168583X → ACNP
Volume
178
Year of publication
2001
Pages
204 - 208
Database
ISI
SICI code
0168-583X(200105)178:<204:IIATAI>2.0.ZU;2-5
Abstract
Ion-beam-induced disordering in single crystals of 6H-SiC and single-crysta l films of gallium nitride (GaN) has been investigated using ion-channeling methods. Amorphization in GaN requires a dose that is about 30 and 100 tim es higher than in silicon carbide (SiC) at 180 and 300 K. respectively. Dyn amic defect-recovery processes in both materials increase with increasing i rradiation temperature. Amorphization in SiC is consistent with a combined direct-impact and defect-stimulated process. Three recovery stages are obse rved on both the Si and C sublattices under isochronal annealing in Au2+-ir radiated 6H-SiC. In GaN, an intermediate saturation state is observed for d isordering at the damage peak, which suggests enhanced defect annihilation processes. Implanted Au diffuses towards the surface during implantation at 300 K and undergoes further diffusion into the amorphous surface layer dur ing post-implantation annealing at 870 K. (C) 2001 Elsevier Science B.V. Al l rights reserved.