FABRICATION OF TI TI5SI3 FUNCTIONALLY GRADED MATERIAL BY EUTECTIC BONDING METHOD/

Ti/Ti5Si3 functionally graded material was fabricated by a eutectic bo nding method. A metal TI and an intermetallic compound Ti5Si3 were bon ded by utilizing a eutectic reaction, where Ti5Si3 was chosen because of its high heat resistance and high oxidation one. In the case of bon ding the stoichiometric Ti5Si3 with the pure Ti, cracks were formed wi thin the Ti5Si3 part. Since the cracking was suspected to occur due to the low ductility of the stoichiometric Ti5Si3, a Ti-rich Ti5Si3 whic h is ductiler than the stoichiometric Ti5Si3 was applied in place of t he stoichiometric Ti5Si3. As a result, a sound FGM without any detecta ble defects was realized.