Yj. Li et al., FORMATION OF SINGLE-CRYSTAL COSI2 BUFFER LAYERS ON SI(100) SUBSTRATESBY HIGH-DOSE CO ION-IMPLANTATION FOR THE DEPOSITION OF YBA2CU3O7-X THIN-FILMS, Journal of materials research, 12(8), 1997, pp. 2072-2080
High quality single-crystal CoSi2 layers have been successfully formed
on Si(100) using low energy high dose Co ion implantation followed by
subsequent annealing method as a buffer layer for the deposition of Y
Ba2Cu3O7-x (YBCO) thin films. Rutherford backscattering spectrometry w
ith channeling (RBS-C) measurements showed that CoSi2 layers after ann
ealing at temperatures between 850 and 950 degrees C had a minimum yie
ld chi(min) of about 3%. X-ray diffraction (XRD) spectra revealed that
CoSi2 layers had the same orientation as the Si(100) substrates. Phi
scan XRD spectra proved that CoSi2 layers epitaxially grew in the cube
-on-cube epitaxial growth mode with respect to the Si(100) substrates.
YBCO films and CeO2/YSZ buffer layers were deposited on CoSi2/Si(100)
substrates via laser ablation and electron beam evaporation, respecti
vely. theta-2 theta, omega, and phi scan XRD spectra illustrated that
YBCO films and CeO2/YSZ buffer layers had the epitaxial structure both
in a-b plane and along the c-axis. YBCO films grown on this multilaye
red structure demonstrated excellent superconducting propel-ties with
the zero resistance transition temperature T-c0 of 87-90 K. The transi
tion width (Delta T-c) was about 1 K. Orientation and epitaxial crysta
lline quality of YBCO films and CeO2/YSZ buffer layers were confirmed
by XRD and RBS-C characterization, All films consisted of c-axis orien
ted grains. RBS-C spectra indicated a high degree of crystalline perfe
ction with a channeling minimum yield for Ba as low as 8%, and interdi
ffusion between the YBCO film and buffer layers or between the YBCO fi
lm and the substrate was limited. This multilayer system shows the pos
sibility for the application of YBa2Cu3O7-x thin films on technical Si
substrates in the field of hybrid superconductor-semiconductor techno
logy.