The deposition of copper cluster on the Cu(0 1 0) surface is studied by mol
ecular dynamics simulation. We used a many-body potential based on the tigh
t-binding model to describe the Cu-Cu interaction. Several quantities are c
alculated to study the influence of the substrate size and substrate temper
ature on the cluster deposition phenomenon. (C) 2001 Elsevier Science B.V.
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