Simulation of transmission waves through multilayered thin conducting sheets by FDTD method

Due to their great fabrication flexibility, multilayered conductive thin fi lms are used as a shielding material by thin film metal plating on a dielec tric body. In the simulation of the shielding effect of these multilayered thin conducting films by the FDTD method, it is necessary to use a cell siz e less than the conductor thickness in direct modeling. However, since the shield material generally is much thicker than the metal thin film, the num ber of cells needed in such modeling is prohibitive and calculation becomes difficult. In this paper, as a subcell method in the FDTD approach, an inf initesimally thin resistive film that has a transmission coefficient equiva lent to the multilayered conducting thin film is introduced. By this techni que, modeling becomes possible without increasing the number of cells unnec essarily. (C) 2001 Scripta Technica, Electron Comm Jpn Pt 1, 84(12): 22-31, 2001.