Multiple microscale plasma CVD apparatuses on a substrate

Citation
T. Ito et K. Terashima, Multiple microscale plasma CVD apparatuses on a substrate, THIN SOL FI, 390(1-2), 2001, pp. 234-236
Citations number
8
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
THIN SOLID FILMS
ISSN journal
00406090 → ACNP
Volume
390
Issue
1-2
Year of publication
2001
Pages
234 - 236
Database
ISI
SICI code
0040-6090(20010630)390:1-2<234:MMPCAO>2.0.ZU;2-1
Abstract
Plasma chemical vapor depositions (CVD) of carbon films using a CH4-H-2 gas system have been performed with a prototype 2 X 2 plasma chip which consis ts of 2 x 2 coplanar film electrodes (CFE). Using this chip, we could perfo rm four plasma processing experiments simultaneously. A plasma chip on whic h plasma-processing apparatuses are integrated has advantages in plasma. pr ocessing compared to conventional ones, such as high processing speed due t o the high density of the microscale plasma, and high efficiency due to par allel processing. We have obtained various carbon films easily, such as gla ssy carbon and diamond-like carbon, with this simple prototype plasma chip. This is the first report on plasma processing with this innovative process ing device, the plasma chip. (C) 2001 Elsevier Science B.V. All rights rese rved.