Nitridation of silicon oxide layers studied with ion beam analysis on the nanometer scale

Citation
A. Markwitz et Gv. White, Nitridation of silicon oxide layers studied with ion beam analysis on the nanometer scale, ADVAN MATER, 13(12-13), 2001, pp. 1027
Citations number
14
Categorie Soggetti
Multidisciplinary,"Material Science & Engineering
Journal title
ADVANCED MATERIALS
ISSN journal
09359648 → ACNP
Volume
13
Issue
12-13
Year of publication
2001
Database
ISI
SICI code
0935-9648(20010704)13:12-13<1027:NOSOLS>2.0.ZU;2-#
Abstract
Ion beam analysis (IBA) on the nanometer scale using the time-of-flight hea vy-ion elastic recoil detection analysis technique reveals changes in the e lemental composition (depth profiling) of high-temperature nitrided thin si licon oxide (SiO2) layers formed on wafer silicon. An increased uptake of n itrogen with both increased temperature and surprisingly increased thicknes s of the thin SiO2 layers has been measured. The initial stage of nitridati on could be illuminated indicating the formation of silicon oxynitride subj ect to nitridation parameters. Previous surface topology investigations wit h scanning electron microscopy (SEM) revealed concentric annular artificial patterns at the surfaces of specially prepared specimens.