Micromechanical properties of silicon-carbide thin films deposited using single-source chemical-vapor deposition

Citation
Cr. Stoldt et al., Micromechanical properties of silicon-carbide thin films deposited using single-source chemical-vapor deposition, APPL PHYS L, 79(3), 2001, pp. 347-349
Citations number
15
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
APPLIED PHYSICS LETTERS
ISSN journal
00036951 → ACNP
Volume
79
Issue
3
Year of publication
2001
Pages
347 - 349
Database
ISI
SICI code
0003-6951(20010716)79:3<347:MPOSTF>2.0.ZU;2-4
Abstract
1,3-Disilabutane is used as a single-source precursor to deposit conformal silicon-carbide films on silicon atomic-force-microscopy cantilevers. By me asuring the resonance frequency of the cantilever as a function of silicon- carbide film thickness and developing an appropriate model, the value of th e film's elastic modulus is determined. This value is in good agreement wit h those reported for silicon-carbide films deposited using conventional dua l-source chemical-vapor deposition. Additionally, we comment on the feasibi lity of integrating this process into the fabrication technology for microe lectromechanical systems. (C) 2001 American Institute of Physics.