We combine a self-organizing diblock copolymer system with semiconductor pr
ocessing to produce silicon capacitors with increased charge storage capaci
ty over planar structures. Our process uses a diblock copolymer thin film a
s a mask for dry etching to roughen a silicon surface on a 30 nm length sca
le, which is well below photolithographic resolution limits. Electron micro
scopy correlates measured capacitance values with silicon etch depth, and t
he data agree well with a geometric estimate. This block copolymer nanotemp
lating process is compatible with standard semiconductor processing techniq
ues and is scalable to large wafer dimensions. (C) 2001 American Institute
of Physics.