We have developed a far UV spectroscopic ellipsometer system working up to
9 eV, and applied it to the characterization of three 4H-SiC samples with d
ifferent surface conditions [i.e., as-received and chemical mechanical proc
essing (CMP) processed 4H-SiC bulk substrates and a 4H-SiC epi sample]. Pse
udodielectric functions epsilon (1) and epsilon (2) clearly demonstrate the
excellent surface sensitivity of the far UV ellipsometry system as it dist
inguishes the improvements provided by CMP process. Simulation results of e
llipsometer data indicate the existence of a damaged subsurface layer in th
e as-received 4H-SiC bulk substrate. The investigation of sample surfaces u
sing atomic force microscopy confirms the results of ellipsometry measureme
nts. (C) 2001 American Institute of Physics.