The diffusion of Sb and B in both Si and SiGe is studied in this work. Inje
ction of both interstitial- and vacancy-type point defects using rapid ther
mal annealing (RTA) in both NH3 and O-2 atmospheres is calibrated for Sb di
ffusion in Si, before examining Sb diffusion in SiGe and B diffusion in Si
and SiGe. Measurement of the diffusion retardation or enhancement under def
ect injection conditions will elucidate the diffusion mechanism and allow d
etermination of the diffusivity, necessary for modeling of device fabricati
on processes. These experiments confirm the predominant mechanism for diffu
sion of Sb in Si and SiGe to be vacancy-mediated, while the predominant mec
hanism for B appears to be interstitial-mediated in Si and SiGe. The diffus
ivity values measured for B in Si and SiGe are reported. (C) 2001 Kluwer Ac
ademic Publishers.