Antimony and boron diffusion in SiGe and Si under the influence of injected point defects

Citation
Jm. Bonar et al., Antimony and boron diffusion in SiGe and Si under the influence of injected point defects, J MAT S-M E, 12(4-6), 2001, pp. 219-221
Citations number
9
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
ISSN journal
09574522 → ACNP
Volume
12
Issue
4-6
Year of publication
2001
Pages
219 - 221
Database
ISI
SICI code
0957-4522(200106)12:4-6<219:AABDIS>2.0.ZU;2-5
Abstract
The diffusion of Sb and B in both Si and SiGe is studied in this work. Inje ction of both interstitial- and vacancy-type point defects using rapid ther mal annealing (RTA) in both NH3 and O-2 atmospheres is calibrated for Sb di ffusion in Si, before examining Sb diffusion in SiGe and B diffusion in Si and SiGe. Measurement of the diffusion retardation or enhancement under def ect injection conditions will elucidate the diffusion mechanism and allow d etermination of the diffusivity, necessary for modeling of device fabricati on processes. These experiments confirm the predominant mechanism for diffu sion of Sb in Si and SiGe to be vacancy-mediated, while the predominant mec hanism for B appears to be interstitial-mediated in Si and SiGe. The diffus ivity values measured for B in Si and SiGe are reported. (C) 2001 Kluwer Ac ademic Publishers.