Hybrid pixel detectors for medical X-ray imaging applications with Si and G
aAs sensors are compared. Both sensor types are bump-bonded onto the MPEC s
ingle photon counting pixel read out chip. The image homogeneity and count
rate of the two assemblies are compared. For the GaAs assembly the active l
ayer thickness and charge collection efficiency have been measured. (C) 200
1 Elsevier Science B.V. All rights reserved.