Measurements with Si and GaAs pixel detectors bonded to photon counting readout chips

Citation
C. Schwarz et al., Measurements with Si and GaAs pixel detectors bonded to photon counting readout chips, NUCL INST A, 466(1), 2001, pp. 87-94
Citations number
12
Categorie Soggetti
Spectroscopy /Instrumentation/Analytical Sciences","Instrumentation & Measurement
Journal title
NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION A-ACCELERATORS SPECTROMETERS DETECTORS AND ASSOCIATED EQUIPMENT
ISSN journal
01689002 → ACNP
Volume
466
Issue
1
Year of publication
2001
Pages
87 - 94
Database
ISI
SICI code
0168-9002(20010621)466:1<87:MWSAGP>2.0.ZU;2-4
Abstract
Detectors fabricated with SI-GaAs and Si bulk material were bonded to Photo n Counting Chips (PCC), developed in the framework of the MEDIPIX Collabora tion. The PCC consists of a matrix of 64 x 64 identical square pixels (170 mum x 170 mum) with a 15-bit counter in each cell. We investigated the imag ing properties of these detector systems under exposure of a dental X-ray t ube at room temperature. The image homogeneity and the mean count rate were determined via hood exposure images and compared. Exposures for GaAs detec tors exhibit a 3 times larger spread in count rate per image in comparison to Si detectors. This also results in a 3 times worse signal to noise ratio . IV-characteristics and X-ray images at different values of the detectors bias voltage were also taken and show a 30 times higher leakage current for GaAs, The Si detector is fully active beginning from 70 V, whereas the GaA s detector does not reach full charge collection. The presampling modulatio n transfer function of both assembly types was measured via slit images and gives a spatial resolution of 4.3 lp/mm for both detector systems. (C) 200 1 Elsevier Science B,V. All rights reserved.