Molecular dynamics (MD) and Monte-Carlo (MC) simulations of low-energy (< 5
00 eV) Ar ion irradiation on Si substrates were performed in order to inves
tigate the mixing and sputtering effects. Both MD and MC simulation show si
milar results in sputtering yield. depth profile of projectile and mixing o
f substrate. For these incident energies, the depth of the mixed region is
determined by the implant range of incident ions. For example, when the inc
ident energy is 500 eV, the Ar ions reach a depth of 40 Angstrom so that th
e Si atoms that reside shallower than 40 Angstrom are fully mixed at an ion
dose of about 5.0 x 10(16) atoms/cm(2). The resolution of secondary ion ma
ss spectrometry (SIMS) was also studied. It was found that the resolution o
f SIMS depends on the depth of mixing, which depends in turn on the implant
range of the probe ions. This is because the mixing of substrate atoms occ
urs more frequently than sputtering, so that the information about the dept
h profile in the mixing region is disturbed. (C) 2001 Elsevier Science B.V.
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