Replication technology for photonic band gap applications

Replication technology was applied for photonic structure fabrication in si licon substrate. II was revealed, that thin thermoplastic polymer layers on silicon substrates may be patterned by hot embossing technique for dry etc hing masking. Ni mold used for plain hot embossing into polymer layers was fabricated by Ni electrochemical deposition on the reference silicon surfac e structure, which was obtained by direct electron beam (EB) writing and SF 6/N-2 reactive ion etching (RIE) technique. It is shown that the shape of r eplicated photonic structures is determined by RIE parameters. (C) 2001 Els evier Science B.V. All rights reserved.