Superconformal electrodeposition in submicron features - art. no. 016102

Superconformal electrodeposition is explained based on a local growth veloc ity that increases with coverage of a catalytic species adsorbed on the cop per-electrolyte interface. For dilute concentration of the catalyst precurs or in the electrolyte, local coverage in fine features changes more due to interface area change than by accumulation from the electrolyte, yielding s uperconformal growth. The model is supported by experiments and simulations of copper deposition in 350-100 nm wide features, helping to explain the i nfluence of adsorbates on roughness evolution.