The localized corrosion of Al at engineered Cu islands

Citation
N. Missert et al., The localized corrosion of Al at engineered Cu islands, JOM-J MIN, 53(7), 2001, pp. 34-36
Citations number
21
Categorie Soggetti
Metallurgy
Journal title
JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY
ISSN journal
10474838 → ACNP
Volume
53
Issue
7
Year of publication
2001
Pages
34 - 36
Database
ISI
SICI code
1047-4838(200107)53:7<34:TLCOAA>2.0.ZU;2-4
Abstract
Arrays of engineered copper islands on an aluminum thin-film matrix have be en employed to investigate the role of copper in localized corrosion of Al- Cu alloys. When exposed to dilute NaCl solutions, the engineered samples co rrode with a morphology similar to that observed in second-phase particles in real alloys. In-situ fluorescence microscopy allows the observation of o xygen reduction at copper islands during corrosion of the underlying alumin um thin-film matrix. The spacing between engineered copper islands was foun d to strongly influence the corrosion rate of the surrounding matrix.