Temperature effect on gate leakage currents in gate dielectric films of GaAs MOSFET

Citation
Jy. Wu et al., Temperature effect on gate leakage currents in gate dielectric films of GaAs MOSFET, SOL ST ELEC, 45(12), 2001, pp. 1999-2003
Citations number
21
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Eletrical & Eletronics Engineeing
Journal title
SOLID-STATE ELECTRONICS
ISSN journal
00381101 → ACNP
Volume
45
Issue
12
Year of publication
2001
Pages
1999 - 2003
Database
ISI
SICI code
0038-1101(200112)45:12<1999:TEOGLC>2.0.ZU;2-6
Abstract
The gate dielectrics of Ga2O3(AS(2)O(3)) of the GaAs MOSFET were prepared b y a low-cost and low-temperature liquid-phase chemically enhanced oxidation method. The temperature and oxide thickness dependence of gate dielectric films on GaAs MOSFET have been investigated. The leakage current and dielec tric breakdown field were both studied. Both gate leakage current density a nd breakdown electrical field were found to depend on the oxide thickness a nd operating temperature. The increasing trend in gate leakage current and the decreasing trend in breakdown electrical field were observed upon reduc ing oxide thickness from 30 to 12 nm and increasing operating temperature f rom -50 degreesC to 200 degreesC. (C) 2001 Elsevier Science Ltd. All rights reserved.