Samples of crystalline silicon, porous silicon, gallium arsenide and s
ilicon diodes were exposed to 50-80 MeV silicon and oxygen ions in the
fluence range of the order of 10(13) to 10(14) ions/cm(2). The irradi
ated samples were characterized to obtain information on the relative
concentration and depth distribution of the induced defects. For compa
rison a few silicon diodes and crystalline silicon samples were also e
xposed to 6 MeV electrons. The main techniques used for the analysis o
f silicon samples were low angle X-ray diffraction, photoluminescence
spectroscopy and lifetime of minority carriers, whereas diodes were ch
aracterized on the basis of switching parameters. It is observed that
a large number of defects are produced in the surface region of each o
f the irradiated semiconductor sample though the energy deposited in t
he surface region through electronic loss is three orders of magnitude
greater than that of nuclear collisions.