G. Pezzotti et al., GROWTH ISOTHERMS OF LIQUID-PHASE SINTERED SILICON-NITRIDE, Nippon Seramikkusu Kyokai gakujutsu ronbunshi, 105(8), 1997, pp. 638-640
Grain-growth data, collected after isothermal treatment of four Si3N4
materials, which contained different metal oxides as densification age
nts, are revisited. Diffusion-controlled Ostwald ripening mechanism is
generally recognized to be mainly responsible for grain coarsening up
on post-densification anneal. Emphasis is placed on rationalizing the
grain-growth rate in terms of viscosity of the residual intergranular
glass. A simple phenomenological equation is given that allows to pred
ict the size of the Si3N4 grains upon annealing process. The pre-expon
ential coefficient and the exponent of the equation were determined us
ing both grain-growth and intergranular viscosity data of a model Si3N
4 system, which contained only pure SiO2 glass at grain boundaries. Th
is general formulation allows to estimate the effective glass viscosit
y of Si3N4-based materials.