TRANSIENT LIQUID-PHASE (TLP) DIFFUSION BONDING OF A COPPER-BASED SHAPE-MEMORY ALLOY USING SILVER AS INTERLAYER

Authors
DESALAZAR JMG MENDEZ FJ URENA A GUILEMANY JM MELLOR BG
Citation
Jmg. Desalazar et al., TRANSIENT LIQUID-PHASE (TLP) DIFFUSION BONDING OF A COPPER-BASED SHAPE-MEMORY ALLOY USING SILVER AS INTERLAYER, Scripta materialia, 37(6), 1997, pp. 861-867
Citations number
11
Categorie Soggetti
Material Science","Metallurgy & Metallurigical Engineering
Journal title
Scripta materialia → ACNP
ISSN journal
13596462
Volume
37
Issue
6
Year of publication
1997
Pages
861 - 867
Database
ISI
SICI code
1359-6462(1997)37:6<861:TL(DBO>2.0.ZU;2-V