Thermally stimulated current (TSC) and relaxation map analysis (RMA) w
as used to characterize the low temperature relaxation of epoxy resin
modified with siloxane oligomers. In aminopropyl-terminated siloxane o
ligomer (ATSO) the beta-relaxation of epoxy resin and the glass transi
tion temperature of siloxane oligomer were folded regardless of the co
ncentration of diphenyl. The beta-relaxation of epoxy resin and the gl
ass transition temperature of oxiranylmethoxy-terminated siloxane olig
omer (OTSO) were folded and shifted to higher temperature as the conce
ntration of diphenyl in siloxane oligomer increased. In the systems co
ntaining of diphenyl in siloxane oligomer a new relaxation peak due to
the space charge was observed in the range of -80 degrees C to -50 de
grees C and -30 degrees C to 5 degrees C. As the concentration of diph
enyl increased the compensation temperature (T-c) and the degree-of-di
sorder (DOD) were increased while the compensation time, tau(c) was de
creased.