STUDY OF SILOXANE-MODIFIED EPOXY-RESIN USING THERMALLY STIMULATED CURRENT .2.

Thermally stimulated current (TSC) and relaxation map analysis (RMA) w as used to characterize the low temperature relaxation of epoxy resin modified with siloxane oligomers. In aminopropyl-terminated siloxane o ligomer (ATSO) the beta-relaxation of epoxy resin and the glass transi tion temperature of siloxane oligomer were folded regardless of the co ncentration of diphenyl. The beta-relaxation of epoxy resin and the gl ass transition temperature of oxiranylmethoxy-terminated siloxane olig omer (OTSO) were folded and shifted to higher temperature as the conce ntration of diphenyl in siloxane oligomer increased. In the systems co ntaining of diphenyl in siloxane oligomer a new relaxation peak due to the space charge was observed in the range of -80 degrees C to -50 de grees C and -30 degrees C to 5 degrees C. As the concentration of diph enyl increased the compensation temperature (T-c) and the degree-of-di sorder (DOD) were increased while the compensation time, tau(c) was de creased.