The transit frequency f(T) of SiGe-heterobipolar transistors (HBT's) w
as increased from 20 GHz to 100 GHz. This was mainly achieved by thick
ness reduction of the double heterojunction SiGe-base from 65 nm to 25
nm. The complete vertical structure of the SiGe-HBT's (collector, bas
e, emitter, emitter contact) was grown in one run by Si molecular beam
epitaxy (Si-MBE). The growth temperature was varied from 650-degrees-
C at the collector side to 325-degrees-C at the emitter contact side.
The different n-type doping levels (10(17)/cm3, 10(18)/cm3, 10(20)/cm3
) were obtained by applying three different Sb-doping techniques (seco
ndary implantation, adatom pre build-up, low temperature doping). The
p-type base was doped with boron. The doping level in the base (6 X 10
(19)/cm3) exceeded the emitter doping level by a factor of 30 (doping
level inversion).